Devices related to shielded radio-frequency modules having reduced area

ABSTRACT

Shielded radio-frequency (RF) module having reduced area. In some embodiments, an RF module can include a packaging substrate configured to receive a plurality of components, and a plurality of shielding wirebonds implemented on the packaging substrate and configured to provide RF shielding functionality for one or more regions on the packaging substrate. The packaging substrate can include a first area associated with implementation of each shielding wirebond. The RF module can further include one or more devices mounted on the packaging substrate. The packaging substrate can further include a second area associated with mounting of each of the one or more devices. Each device can be mounted with respect to a corresponding shielding wirebond such that the second area associated with the device overlaps at least partially with the first area associated with the corresponding shielding wirebond.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a division of U.S. patent application Ser. No.15/701,643, filed Sep. 12, 2017, entitled “METHODS FOR FORMING SHIELDEDRADIO-FREQUENCY MODULES HAVING REDUCED AREA,” which is a division ofU.S. patent application Ser. No. 14/869,952, filed Sep. 29, 2015,entitled “SHIELDED RADIO-FREQUENCY MODULE HAVING REDUCED AREA,” whichclaims priority to U.S. Provisional Application No. 62/058,039, filedSep. 30, 2014, entitled “SHIELDED RADIO-FREQUENCY MODULE HAVING REDUCEDAREA,” the disclosure of each of which is hereby expressly incorporatedby reference herein in its entirety.

BACKGROUND Field

The present disclosure relates to a shielded radio-frequency (RF)module.

Description of the Related Art

In many electronic applications, a radio-frequency (RF) module can beimplemented as a packaged module. Such a packaged module can include apackaging substrate such as a laminate substrate, and variouscomponent(s) mounted thereon.

In some embodiments, the foregoing packaged RF module can include RFshielding features such as shielding wirebonds. Such shielding wirebondscan provide shielding functionality between a given location on thepackaged RF module and another location external or internal to themodule.

SUMMARY

According to some implementations, the present disclosure relates to aradio-frequency (RF) module that includes a packaging substrateconfigured to receive a plurality of components, and a plurality ofshielding wirebonds implemented on the packaging substrate andconfigured to provide RF shielding functionality for one or more regionson the packaging substrate. The packaging substrate includes a firstarea associated with implementation of each shielding wirebond. The RFmodule further includes one or more devices mounted on the packagingsubstrate. The packaging substrate further includes a second areaassociated with mounting of each of the one or more devices. Each deviceis mounted with respect to a corresponding shielding wirebond such thatthe second area associated with the device overlaps at least partiallywith the first area associated with the corresponding shieldingwirebond.

In some embodiments, the packaging substrate can include a laminatesubstrate.

In some embodiments, each of the shielding wirebonds can have a loopshape that is asymmetric or approximately symmetric. The packagingsubstrate can include first and second contact pads configured to securefirst and second ends of the loop shaped shielding wirebond. Each of theone or more devices can be an SMT device configured to be mounted onfirst and second contact pads. The first area can be at least as largeas a first elongated region having opposing ends defined by the firstand second contact pads for the loop shaped shielding wirebond. Thesecond area can be a second elongated region having opposing endsdefined by the first and second contact pads for the SMT device. Each ofthe first and second contact pads for the loop shaped shielding wirebondcan have a rectangular shape, such that the first elongated region hasan approximately rectangular shape. Each of the first and second contactpads for the SMT device can have a rectangular shape, such that thesecond elongated region has an approximately rectangular shape. Thefirst elongated shape and the second elongated shape can be arranged inan approximately perpendicular manner.

In some embodiments, the at least partial overlap can include at leastsome of the first or second contact pads for the SMT device being withinthe first elongated region. The at least partial overlap can furtherinclude at least some of the SMT device being within the first elongatedregion. A portion of the SMT device can be underneath the loop shapedshielding wirebond.

In some embodiments, the first area can include a first region betweenone contact pad for the loop shaped shielding wirebond and a contact padfor a neighboring loop shaped shielding wirebond. The second area caninclude a second region having opposing ends defined by the first andsecond contact pads for the SMT device.

In some embodiments, each of the shielding wirebonds can include a firstend attached to the packaging substrate and a second end positionedabove the packaging substrate to yield a single-ended shielding wirebondconfiguration. The packaging substrate can include a contact padconfigured to secure the first end of the single-ended shieldingwirebond to the packaging substrate. Each of the one or more devices canbe an SMT device configured to be mounted on first and second contactpads. The first area can include a first region between the contact padfor the single-ended shielding wirebond and a contact pad for aneighboring single-ended shielding wirebond. The second area can be asecond elongated region having opposing ends defined by the first andsecond contact pads for the SMT device.

In some teachings, the present disclosure relates to a method forfabricating a radio-frequency (RF) module. The method includes formingor providing a packaging substrate configured to receive a plurality ofcomponents, and mounting one or more devices on the packaging substratesuch that the packaging substrate includes an area associated withmounting of each of the one or more devices. The method further includesforming a plurality of shielding wirebonds on the packaging substrate toprovide RF shielding functionality for one or more regions on thepackaging substrate, such that the packaging substrate includes an areaassociated with formation of each shielding wirebond. The mounting ofeach device is implemented with respect to a corresponding shieldingwirebond such that the area associated with the device overlaps at leastpartially with the area associated with the corresponding shieldingwirebond.

In some embodiments, the forming of the plurality of shielding wirebondscan include forming a plurality of double-ended shielding wirebonds. Insome embodiments, at least one of the one or more devices can be mountedsuch that at least a portion of the area associated with mounting of thedevice is generally under a corresponding double-ended shieldingwirebond. In some embodiments, at least one of the one or more devicescan be mounted such that at least a portion of the area associated withmounting of the device is generally between two neighboring double-endedshielding wirebonds.

In some embodiments, the forming of the plurality of shielding wirebondscan include forming a plurality of single-ended shielding wirebonds. Atleast one of the one or more devices can be mounted such that at least aportion of the area associated with mounting of the device is generallybetween two neighboring single-ended shielding wirebonds.

In some implementations, the present disclosure relates to a wirelessdevice that includes a transceiver and a radio-frequency (RF) module incommunication with the transceiver and configured to process an RFsignal. The RF module includes a packaging substrate configured toreceive a plurality of components, and a plurality of shieldingwirebonds implemented on the packaging substrate and configured toprovide RF shielding functionality for one or more regions on thepackaging substrate. The packaging substrate includes a first areaassociated with implementation of each shielding wirebond. The RF modulefurther includes one or more devices mounted on the packaging substrate.The packaging substrate further includes a second area associated withmounting of each of the one or more devices. Each device is mounted withrespect to a corresponding shielding wirebond such that the second areaassociated with the device overlaps at least partially with the firstarea associated with the corresponding shielding wirebond. The RF modulefurther includes an antenna in communication with the RF module andconfigured to facilitate transmission or reception of the RF signal.

In some embodiments, the wireless device can be a cellular phone. The RFmodule can be smaller in size than a functionally comparable module inwhich the second area does not overlap with the first area.

For purposes of summarizing the disclosure, certain aspects, advantagesand novel features of the inventions have been described herein. It isto be understood that not necessarily all such advantages may beachieved in accordance with any particular embodiment of the invention.Thus, the invention may be embodied or carried out in a manner thatachieves or optimizes one advantage or group of advantages as taughtherein without necessarily achieving other advantages as may be taughtor suggested herein.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows an example shielding configuration that can be implementedfor a radio-frequency (RF) module.

FIG. 2 shows another example shielding configuration that can beimplemented for an RF module.

FIG. 3 shows a closer view of an example of how one or more shieldingwirebonds can be implemented on a packaging substrate of an RF module.

FIG. 4A shows a side view of an example shielding wirebond that can beimplemented for the configuration of FIG. 3.

FIG. 4B shows a side view of another example shielding wirebond that canbe implemented for the configuration of FIG. 3.

FIG. 5 shows a closer view of another example of how one or moreshielding wirebonds can be implemented on a packaging substrate of an RFmodule.

FIG. 6 shows a side view of example shielding wirebonds that can beimplemented for the configuration of FIG. 5.

FIG. 7 shows an example shielding configuration in which an SMT devicefootprint can be at least partially within a keep-out area associatedwith a shielding wirebond.

FIG. 8 shows another example shielding configuration in which a mountingarea for an SMT device can be at least partially within a keep-out areaassociated with a shielding wirebond.

FIG. 9 shows another shielding configuration in which both sides of ashielding wirebond can be utilized for mounting of an SMT device.

FIG. 10 shows an example shielding configuration in which an SMT devicefootprint can be at least partially within a keep-out area between twosingle-ended shielding wirebonds.

FIG. 11 shows another example shielding configuration in which amounting area for an SMT device can be at least partially within akeep-out area between two single-ended shielding wirebonds.

FIG. 12 shows another shielding configuration in which both sides of aline defined by two single-ended shielding wirebonds can be utilized formounting of an SMT device.

FIG. 13 shows an example shielding configuration in which an SMT devicefootprint can be at least partially within a keep-out area between twodouble-ended shielding wirebonds.

FIG. 14 shows another example shielding configuration in which amounting area for an SMT device can be at least partially within akeep-out area between two double-ended shielding wirebonds.

FIG. 15 shows another shielding configuration in which both sides of aline defined by two double-ended shielding wirebonds can be utilized formounting of an SMT device.

FIG. 16 shows a perspective view of an example shielding configurationhaving one or more features as described herein.

FIG. 17 shows a plan view of the example shielding configuration of FIG.16.

FIG. 18 shows a process that can be implemented to fabricate an RFmodule having one or more features as described herein.

FIG. 19 shows a process that can be implemented as an example of theprocess of FIG. 18.

FIG. 20 shows a process that can be implemented as another example ofthe process of FIG. 18.

FIG. 21 depicts an RF module having one or more advantageous featuresdescribed herein.

FIG. 22 depicts an example wireless device having one or moreadvantageous features described herein.

DETAILED DESCRIPTION OF SOME EMBODIMENTS

The headings provided herein, if any, are for convenience only and donot necessarily affect the scope or meaning of the claimed invention.

In some radio-frequency (RF) modules, shielding can be implemented withuse of wirebonds. FIGS. 1 and 2 show examples of such RF shieldingconfigurations. In the example of FIG. 1, an RF module 10 can include apackaging substrate 12 such as a laminate substrate. A number of devicescan be mounted on such a packaging substrate. For example, a die 14having an RF circuit can be mounted on the packaging substrate 12, andconnections between the die 14 and the packaging substrate 12 can beimplemented by, for example, wirebonds. In another example, one or moreSMT devices (e.g., depicted as 16, 18) can also be mounted on thepackaging substrate 12.

In the example of FIG. 1, a plurality of RF shielding wirebonds 20 areshown to be implemented near the periphery of the packaging substrate12. Such RF shielding wirebonds can provide an electrical connectionbetween a conductive layer (not shown) formed over the packagingsubstrate 12 (e.g., on an overmold structure and electrically connectedto upper portions of the RF shielding wirebonds 20) and a ground plane(e.g., within the packaging substrate and electrically connected tolower portions of the RF shielding wirebonds 20), to thereby provideshielding functionality between a region generally within a boundarydefined by the RF shielding wirebonds 20 and a region outside of theboundary.

FIG. 2 shows another example of an RF module 10 having RF shieldingfunctionality. Similar to the example of FIG. 1, such a module caninclude a packaging substrate 12 such as a laminate substrate. A numberof devices can be mounted on such a packaging substrate. For example, afirst die 24 and a second die 26, each having an RF circuit, can bemounted on the packaging substrate 12, and connections between the die24, 26 and the packaging substrate 12 can be implemented by, forexample, wirebonds.

In the example of FIG. 2, a plurality of RF shielding wirebonds 20 areshown to be implemented between the first and second die 24, 26. Such RFshielding wirebonds can provide an electrical connection between aconductive layer (not shown) formed over the packaging substrate 12(e.g., on an overmold structure and electrically connected to upperportions of the RF shielding wirebonds 20) and a ground plane (e.g.,within the packaging substrate and electrically connected to lowerportions of the RF shielding wirebonds 20), to thereby provide shieldingfunctionality between the regions associated with the first and seconddie 24, 26.

In the examples of FIGS. 1 and 2, implementation of the respectiveshielding wirebonds 20 typically results in an area on the packagingsubstrate 12 that is not utilized for other purpose. In the example ofFIG. 1, a band 28 about the boundary defined by the shielding wirebonds20 can represent such an area (also referred to herein as a keep-outarea). In the example of FIG. 2, a band 28 about the segment defined bythe shielding wirebonds 20 can represent such a keep-out area.

Described herein are examples of how at least some of such keep-outareas can be utilized for other purpose, to thereby yield a moreefficient use of space in RF modules. Advantageously, such an efficientuse of space can yield smaller sized RF modules.

FIG. 3 shows a closer view of an example of how a shielding wirebond 20can be implemented on a packaging substrate. The view shown in FIG. 3 isa plan view; accordingly, the shielding wirebond 20 is depicted as aline. It will be understood that such a wirebond can have differentshapes.

For example, FIG. 4A shows an example shielding wirebond 20 having anasymmetrical shape with two ends attached to the packaging substrate (32in FIG. 3) through contact pads 30 a, 30 b. In another example, FIG. 4Bshows an example shielding wirebond 20 having a symmetrical (orapproximately symmetrical) shape with two ends attached to the packagingsubstrate (32 in FIG. 3) through contact pads 30 a, 30 b.

Referring to the example of FIG. 3, the shielding wirebond 20 is shownto be formed between two contact pads 30 a, 30 b. Such contact pads canbe electrically connected to a grounding strip 32 which is in turnelectrically connected to a ground plane (not shown in FIG. 3). In thecontext of the example shielding configuration of FIG. 1, the groundingstrip 32 can form a grounding ring at or near the periphery of thepackaging substrate 12. In the context of the example shieldingconfiguration of FIG. 2, the grounding strip 32 can form a strip segmentnext to or underneath the segment defined by the shielding wirebonds.

In the example of FIG. 3, a keep-out region 28 can include at least astrip of area generally corresponding to the width needed to implementthe contact pads 30 a, 30 b. Such a keep-out region can also include thegrounding strip 32 for non-grounding use.

In the examples of FIGS. 3 and 4, the shielding wirebonds 20 have adouble-ended configuration in which both ends of a given wirebond areattached to their respective contact pads. In some embodiments, ashielding wirebond can be attached to a packaging substrate in asingle-ended manner, and one or more features of the present disclosurecan also be implemented with respect to such a single-ended shieldingwirebond.

FIGS. 5 and 6 show plan and side views of example single-ended shieldingwirebonds 20, where one end of each shielding wirebond is attached toits respective contact pad 30. Such a contact pad can be implemented ona grounding strip 32, such that the shielding wirebond 20 iselectrically connected to a ground plane (e.g., within the packagingsubstrate. The other end of the shielding wirebond 20 is shown to remaingenerally above the contact pad 30. Such other end of the shieldingwirebond 20 can be in electrical contact with a conductive layer (notshown) to provide a grounding connection between the conductive layerand the ground plane. Additional details concerning the exampleshielding wirebonds (double-ended or single-ended) can be found in, forexample, U.S. Pat. No. 9,071,335 entitled RADIO-FREQUENCY MODULES HAVINGTUNED SHIELDING-WIREBONDS, which is expressly incorporated by referencein its entirety.

FIGS. 7-15 show non-limiting examples of how at least some of a keep-outregion on a packaging substrate can be utilized for a purpose other thanRF shielding. FIGS. 7-9 show examples in the context of a shieldingwirebond having a double-ended configuration, and a keep-out regionutilized for mounting of a component being between the two ends of sucha shielding wirebond. FIGS. 10-12 show examples in the context of ashielding wirebond having a single-ended configuration, and a keep-outregion utilized for mounting of a component being adjacent to such ashielding wirebond. FIGS. 13-15 show examples in the context of ashielding wirebond having a double-ended configuration, and a keep-outregion utilized for mounting of a component being adjacent to such ashielding wirebond.

In some embodiments, an area associated with mounting of a component(e.g., an SMT device) on the packaging substrate can partially or fullyoverlap with a keep-out area associated with implementation of one ormore shielding wirebonds. The area associated with the mounting of theSMT device can include, for example, a footprint of the SMT itself, andfootprint of one or more contact pads utilized for the mounting andelectrical connections for the SMT device.

In FIGS. 7-9, the SMT device is indicated as 102, and the contact padsare indicated as 104 a, 104 b. It will be understood that there may beother numbers of contact pads associated with mounting of the SMT device102. In some embodiments, the foregoing area associated with themounting of the SMT device can include a net footprint formed by the SMTdevice 102 and/or the contact pads 104 a, 104 b. In some embodiments,the foregoing area associated with the mounting of the SMT device caninclude a smallest rectangle that covers the SMT device 102 and thecontact pads 104 a, 104 b. For example, a rectangle having opposing endsdefined by the contact pads 104 a, 104 b can be an area associated withthe mounting of the SMT device.

In some embodiments, the foregoing keep-out area associated withimplementation of one or more shielding wirebonds can include a stripgenerally indicated as 28. For a given double-ended shielding wirebond,such a keep-out area can include a rectangle having opposing endsdefined by the contact pads (30 a, 30 b in FIGS. 7 and 8; 106 a, 106 bin FIG. 9). In some embodiments, the foregoing keep-out area associatedwith implementation of a shielding wirebond can further include an areaassociated with conductive features (e.g., tabs extending from thegrounding strip 32) utilized to implement the contact pads for theshielding wirebond, whether in a net-footprint form or a smallestinclusive rectangle form.

FIGS. 7-9 show that in some embodiments, at least some of an areaassociated with the mounting of a SMT device 102 (also referred toherein as a mounting area) can overlap with a keep-out area associatedwith implementation of a shielding wirebond (also referred to herein asa keep-out area). In the example of FIG. 7, a shielding configuration100 is shown to include an overlap between the mounting area and thekeep-out area, such that one contact pad (104 b) is substantially withinthe keep-out area (e.g., a rectangle having opposing ends defined by thecontact pads 30 a, 30 b) and the SMT device footprint is partiallywithin the keep-out area. In such a configuration, a portion of the SMTdevice 102 can be generally underneath the shielding wirebond 20.

In some embodiments, a shielding configuration can also include anoverlap between the mounting area and the keep-out area, such that onecontact pad (e.g., 104 b in FIG. 7) is at least partially within thekeep-out area (e.g., a rectangle having opposing ends defined by thecontact pads 30 a, 30 b) and the SMT device footprint is substantiallyout of the keep-out area. In such a configuration, the SMT device 102generally will not be underneath the shielding wirebond 20.

In the example of FIG. 8, a shielding configuration 100 is shown toinclude an overlap between the mounting area and the keep-out area, suchthat one contact pad (104 b) is at least partially within the keep-outarea (e.g., a rectangle having opposing ends defined by the contact pads30 a, 30 b) and the SMT device footprint is also at least partiallywithin the keep-out area. In such a configuration, a portion of the SMTdevice 102 may or may not be underneath the shielding wirebond 20.

In the examples of FIGS. 7 and 8, the grounding strip 32 occupies oneside of the shielding wirebond 20. Accordingly, it may not be practicalto utilize such an area for non-grounding purpose. However, there may beshielding applications where both sides of a shielding wirebond aregenerally free from such a grounding strip. In such a configuration, theshielding wirebond can be grounded through a lower layer so as to leavethe upper surface of the packaging substrate generally free fromgrounding features (other than the related contact pads). FIG. 9 showsan example of such a shielding configuration.

In FIG. 9, a shielding configuration 100 is shown to allow use of bothsides of a shielding wirebond 20 for mounting of an SMT device 102 morefreely than the examples of FIGS. 7 and 8. Accordingly, a mid-portion ofthe SMT device 102 can be underneath the shielding wirebond 20, withcontact pads 104 a, 104 b being positioned on opposing sides of theshielding wirebond 20. In such a configuration, the SMT device 102 canbe at least partially within the keep-out area (e.g., a rectangle havingopposing ends defined by the contact pads 106 a, 106 b). In the exampleshown, each of the contact pads 104 a, 104 b may or may not overlap withthe keep-out area.

In the examples of FIGS. 7-9, the length-wise direction of the SMTdevice 102 is shown to be generally perpendicular to the plan-viewextension direction of the corresponding shielding wirebond 20.Depending on the size of the SMT device, the size of correspondingcontact pads, and/or the size of the shielding wirebond, such an SMTdevice can be oriented in other directions relative to the shieldingwirebond.

In FIGS. 10-12, the SMT device is indicated as 102, and the contact padsare indicated as 104 a, 104 b. It will be understood that there may beother numbers of contact pads associated with mounting of the SMT device102. In some embodiments, the foregoing area associated with themounting of the SMT device can include a net footprint formed by the SMTdevice 102 and/or the contact pads 104 a, 104 b. In some embodiments,the foregoing area associated with the mounting of the SMT device caninclude a smallest rectangle that covers the SMT device 102 and thecontact pads 104 a, 104 b. For example, a rectangle having opposing endsdefined by the contact pads 104 a, 104 b can be an area associated withthe mounting of the SMT device.

In some embodiments, the foregoing keep-out area associated withimplementation of one or more shielding wirebonds can include a stripgenerally indicated as 28. For a given single-ended shielding wirebond,such a keep-out area can include a rectangle having opposing endsdefined by neighboring contact pads (30 in FIGS. 10 and 11; 106 in FIG.12). In some embodiments, the foregoing keep-out area associated withimplementation of a shielding wirebond can further include an areaassociated with conductive features (e.g., tabs extending from thegrounding strip 32) utilized to implement the contact pads for theshielding wirebonds, whether in a net-footprint form or a smallestinclusive rectangle form.

FIGS. 10-12 show that in some embodiments, at least some of an areaassociated with the mounting of a SMT device 102 (also referred toherein as a mounting area) can overlap with a keep-out area associatedwith implementation of a shielding wirebond (also referred to herein asa keep-out area). In the example of FIG. 10, a shielding configuration100 is shown to include an overlap between the mounting area and thekeep-out area, such that one contact pad (104 b) is substantially withinthe keep-out area (e.g., a rectangle having opposing ends defined by theneighboring contact pads 30) and the SMT device footprint is partiallywithin the keep-out area. In such a configuration, a portion of the SMTdevice 102 can be generally underneath a line 33 defined between twoadjacent single-ended shielding wirebonds 20.

In some embodiments, a shielding configuration can also include anoverlap between the mounting area and the keep-out area, such that onecontact pad (e.g., 104 b in FIG. 10) is at least partially within thekeep-out area (e.g., a rectangle having opposing ends defined by theneighboring contact pads 30) and the SMT device footprint issubstantially out of the keep-out area. In such a configuration, the SMTdevice 102 generally will not be underneath the line (e.g., 33 in FIG.10) between two adjacent single-ended wirebonds 20.

In the example of FIG. 11, a shielding configuration 100 is shown toinclude an overlap between the mounting area and the keep-out area, suchthat one contact pad (104 b) is at least partially within the keep-outarea (e.g., a rectangle having opposing ends defined by the neighboringcontact pads 30) and the SMT device footprint is also at least partiallywithin the keep-out area. In such a configuration, a portion of the SMTdevice 102 may or may not be underneath the line 33 defined between twoadjacent single-ended shielding wirebonds 20.

In the examples of FIGS. 10 and 11, the grounding strip 32 occupies oneside of the line 33 defined by the shielding wirebonds 20. Accordingly,it may not be practical to utilize such an area for non-groundingpurpose. However, there may be shielding applications where both sidesof a line defined by shielding wirebonds are generally free from such agrounding strip. In such a configuration, the shielding wirebonds can begrounded through a lower layer so as to leave the upper surface of thepackaging substrate generally free from grounding features (other thanthe related contact pads). FIG. 12 shows an example of such a shieldingconfiguration.

In FIG. 12, a shielding configuration 100 is shown to allow use of bothsides of a line 33 defined by single-ended shielding wirebonds 20 formounting of an SMT device 102 more freely than the examples of FIGS. 10and 11. Accordingly, a mid-portion of the SMT device 102 can beunderneath the line 33, with contact pads 104 a, 104 b being positionedon opposing sides of the line 33. In such a configuration, the SMTdevice 102 can be at least partially within the keep-out area (e.g., arectangle having opposing ends defined by the neighboring contact pads106). In the example shown, each of the contact pads 104 a, 104 b may ormay not overlap with the keep-out area.

In the examples of FIGS. 10-12, the length-wise direction of the SMTdevice 102 is shown to be generally perpendicular to the plan-viewextension direction of the line 33 defined by the shielding wirebonds20. Depending on the size of the SMT device, the size of correspondingcontact pads, and/or the spacing between the shielding wirebonds, suchan SMT device can be oriented in other directions relative to theshielding wirebonds.

It is noted that the examples of FIGS. 10-12 are related to utilizing atleast some of a keep-out area between two neighboring single-endedshielding wirebonds. In some embodiments, such a configuration can alsobe implemented between neighboring double-ended shielding wirebonds.FIGS. 13-15 show examples of such a configuration.

In FIGS. 13-15, the SMT device is indicated as 102, and the contact padsare indicated as 104 a, 104 b. It will be understood that there may beother numbers of contact pads associated with mounting of the SMT device102. In some embodiments, the foregoing area associated with themounting of the SMT device can include a net footprint formed by the SMTdevice 102 and/or the contact pads 104 a, 104 b. In some embodiments,the foregoing area associated with the mounting of the SMT device caninclude a smallest rectangle that covers the SMT device 102 and thecontact pads 104 a, 104 b. For example, a rectangle having opposing endsdefined by the contact pads 104 a, 104 b can be an area associated withthe mounting of the SMT device.

In some embodiments, the foregoing keep-out area associated withimplementation of one or more shielding wirebonds can include a stripgenerally indicated as 28. For a given double-ended shielding wirebond,such a keep-out area can include a rectangle having opposing endsdefined by neighboring contact pads (30 b, 30 a in FIGS. 13 and 14; 106b, 106 a in FIG. 15). In some embodiments, the foregoing keep-out areaassociated with implementation of a shielding wirebond can furtherinclude an area associated with conductive features (e.g., tabsextending from the grounding strip 32) utilized to implement the contactpads for the shielding wirebonds, whether in a net-footprint form or asmallest inclusive rectangle form.

FIGS. 13-15 show that in some embodiments, at least some of an areaassociated with the mounting of a SMT device 102 (also referred toherein as a mounting area) can overlap with a keep-out area associatedwith implementation of a shielding wirebond (also referred to herein asa keep-out area). In the example of FIG. 13, a shielding configuration100 is shown to include an overlap between the mounting area and thekeep-out area, such that one contact pad (104 b) is substantially withinthe keep-out area (e.g., a rectangle having opposing ends defined by theneighboring contact pads 30 b, 30 a) and the SMT device footprint ispartially within the keep-out area. In such a configuration, a portionof the SMT device 102 can be generally underneath a line defined betweentwo adjacent double-ended shielding wirebonds 20.

In some embodiments, a shielding configuration can also include anoverlap between the mounting area and the keep-out area, such that onecontact pad (e.g., 104 b in FIG. 13) is at least partially within thekeep-out area (e.g., a rectangle having opposing ends defined by theneighboring contact pads 30 b, 30 a) and the SMT device footprint issubstantially out of the keep-out area. In such a configuration, the SMTdevice 102 generally will not be underneath the line between twoadjacent double-ended wirebonds 20.

In the example of FIG. 14, a shielding configuration 100 is shown toinclude an overlap between the mounting area and the keep-out area, suchthat one contact pad (104 b) is at least partially within the keep-outarea (e.g., a rectangle having opposing ends defined by the neighboringcontact pads 30 b, 30 a) and the SMT device footprint is also at leastpartially within the keep-out area. In such a configuration, a portionof the SMT device 102 may or may not be underneath the line definedbetween two adjacent double-ended shielding wirebonds 20.

In the examples of FIGS. 13 and 14, the grounding strip 32 occupies oneside of the line defined by the shielding wirebonds 20. Accordingly, itmay not be practical to utilize such an area for non-grounding purpose.However, there may be shielding applications where both sides of a linedefined by shielding wirebonds are generally free from such a groundingstrip. In such a configuration, the shielding wirebonds can be groundedthrough a lower layer so as to leave the upper surface of the packagingsubstrate generally free from grounding features (other than the relatedcontact pads). FIG. 15 shows an example of such a shieldingconfiguration.

In FIG. 15, a shielding configuration 100 is shown to allow use of bothsides of a line defined by double-ended shielding wirebonds 20 formounting of an SMT device 102 more freely than the examples of FIGS. 13and 14. Accordingly, a mid-portion of the SMT device 102 can beunderneath such a line, with contact pads 104 a, 104 b being positionedon opposing sides of the line. In such a configuration, the SMT device102 can be at least partially within the keep-out area (e.g., arectangle having opposing ends defined by the neighboring contact pads106 b, 106 a). In the example shown, each of the contact pads 104 a, 104b may or may not overlap with the keep-out area.

In the examples of FIGS. 13-15, the length-wise direction of the SMTdevice 102 is shown to be generally perpendicular to the plan-viewextension direction of the line defined by the shielding wirebonds 20.Depending on the size of the SMT device, the size of correspondingcontact pads, and/or the spacing between the shielding wirebonds, suchan SMT device can be oriented in other directions relative to theshielding wirebonds.

In the various examples described in reference to FIGS. 7-15, theshielding wirebonds are depicted as being implemented in a double-endedor single-ended configuration. Further, various uses of keep-out areasare described as being generally underneath a double-ended shieldingwirebond, or as being generally between neighboring shielding wirebonds(single-ended or double-ended). However, it will be understood that ashielding configuration can include any combination of one or moresingle-ended shielding wirebonds and one or more double-ended shieldingwirebonds. Accordingly, use of keep-out areas in such a shieldingconfiguration can include any combination of the examples describedherein.

It will also be understood that even if a given shielding configurationinvolves only one type of shielding wirebonds (e.g., single-ended ordouble-ended), use of keep-out areas in such a shielding configurationcan include any combination of the examples described herein.

In some applications, the vertical and/or side dimensions of a shieldingwirebond, and/or spacings between shielding wirebonds, can be adjustedto provide effective shielding for intended frequencies. There may be arange of such dimensions/spacings in which effective shielding can beprovided. Accordingly, dimensions of a loop profile of the shieldingwirebond can be selected to provide effective shielding functionality,and to allow such a loop to be formed over an SMT device and/or relatedcontact features. Similarly, spacing between shielding wirebonds can beselected to provide effective shielding functionality, and to allowmounting of an SMT device and/or related contact features. Suchflexibility in dimensioning/spacing associated with shieldingwirebond(s) can allow a number of different sized SMT devices to bemounted in areas that are traditionally in keep-out areas. Accordingly,significant savings in area can be realized. Such savings in area canresult in smaller sized RF modules without sacrificing shieldingperformance, which in turn can yield improved products such as wirelessdevices.

FIG. 16 shows a perspective view of a shielding configuration 100 havingone or more features as described herein. FIG. 17 shows a plan view ofthe same example shielding configuration 100. In the example of FIGS. 16and 17, shielding wirebonds 20 are shown to be grounded through, forexample, contact pads 30 a, 30 b and a grounding strip 32. An area undereach of the shielding wirebonds 20 is shown to be utilized for mountingof an SMT device 102 (with contact pads 104 a, 104 b) as describedherein. Although each shielding wirebond 20 shown in FIGS. 16 and 17 isshown to be utilized in such a manner, it will be understood that notall shielding wirebonds on a given packaging substrate need to have anSMT or other device mounted thereunder.

FIG. 18 shows a process 180 that can be implemented to fabricate an RFmodule having one or more features as described herein. In block 182, apackaging substrate can be formed or provided. Such a packagingsubstrate can be configured to receive a plurality of shieldingwirebonds. In block 184, a device such as an SMT device can be mountedin an area that overlaps with a keep-out area associated with ashielding wirebond. In block 186, a shielding wirebond associated withthe keep-out area can be formed relative to the device.

FIG. 19 shows a process 200 that can be implemented as an example of theprocess 180 of FIG. 18. In block 202, a packaging substrate can beformed or provided. Such a packaging substrate can be configured toreceive a plurality of shielding wirebonds. In block 204, a device suchas an SMT device can be mounted in an area that overlaps with a keep-outarea associated with a shielding wirebond. In block 206, a shieldingwirebond associated with the keep-out area can be formed over thedevice.

FIG. 20 shows a process 220 that can be implemented as another exampleof the process 180 of FIG. 18. In block 222, a packaging substrate canbe formed or provided. Such a packaging substrate can be configured toreceive a plurality of shielding wirebonds. In block 224, a device suchas an SMT device can be mounted in an area that overlaps with a keep-outarea associated with a shielding wirebond. In block 226, a shieldingwirebond associated with the keep-out area can be formed adjacent thedevice.

As described herein, one or more keep-out areas on a packaging substratecan be utilized for mounting of device(s) such as SMT device(s). Suchutilization of space on the packaging substrate can allow moreflexibility in use of limited available area on the packaging substrate.Benefits resulting from such design flexibility can include, forexample, reduced lateral dimensions of the packaging substrate, andtherefore, reduced size of the corresponding packaged module.

FIG. 21 depicts a packaged module 300 (e.g., an RF module) in which anRF shielding configuration 100 as described herein is implemented at oneor more locations on a packaging substrate 302. Such a packagingsubstrate can be configured to receive a plurality of components,including one or more die having RF circuit(s) (e.g., 304, 306), and aplurality of SMT components. As described herein, at least some of suchSMT components can be implemented with the one or more shieldingconfigurations 100.

FIG. 21 further shows that the packaged RF module 300 can benefit from areduced size (e.g., d1×d2) relative to a functionally comparablepackaged RF module 10 (e.g., d1′×d2′) that does not utilize its keep-outspace. It is noted that if a plurality of such reduced-sized packagedmodules are implemented on a circuit board such as a phone board, spacesaving can be even greater than that provided by one module.

In some implementations, a device and/or a configuration having one ormore features described herein can be included in an RF device such as awireless device. Such a device and/or a circuit can be implementeddirectly in the wireless device, in a modular form as described herein,or in some combination thereof. In some embodiments, such a wirelessdevice can include, for example, a cellular phone, a smart-phone, ahand-held wireless device with or without phone functionality, awireless tablet, etc.

FIG. 22 depicts an example wireless device 400 having one or moreadvantageous features described herein. In the context of a modulehaving one or more features as described herein, such a module can begenerally depicted by a dashed box 300, and can be implemented as afront-end module (FEM). Other modules in the wireless device 400 canalso benefit from implementation of one or more features as describedherein. In the example of FIG. 22, the module 300 is shown to include aRF shielding configuration 100 having one or more features as describedherein.

PAs 412 can receive their respective RF signals from a transceiver 410that can be configured and operated to generate RF signals to beamplified and transmitted, and to process received signals. Thetransceiver 410 is shown to interact with a baseband sub-system 408 thatis configured to provide conversion between data and/or voice signalssuitable for a user and RF signals suitable for the transceiver 410. Thetransceiver 410 is also shown to be connected to a power managementcomponent 406 that is configured to manage power for the operation ofthe wireless device. Such power management can also control operationsof the baseband sub-system 408 and the module 300.

The baseband sub-system 408 is shown to be connected to a user interface402 to facilitate various input and output of voice and/or data providedto and received from the user. The baseband sub-system 408 can also beconnected to a memory 404 that is configured to store data and/orinstructions to facilitate the operation of the wireless device, and/orto provide storage of information for the user.

In the example wireless device 400, outputs of the PAs 412 are shown tobe matched (via respective match circuits 414) and routed to an antenna422 through a band selection switch 416, their respective duplexers 418and an antenna switch 420. In some embodiments, each duplexer 418 canallow transmit and receive operations to be performed simultaneouslyusing a common antenna (e.g., 422). In FIG. 22, received signals areshown to be routed to “Rx” paths (not shown) that can include, forexample, one or more low-noise amplifiers (LNAs).

A number of other wireless device configurations can utilize one or morefeatures described herein. For example, a wireless device does not needto be a multi-band device. In another example, a wireless device caninclude additional antennas such as diversity antenna, and additionalconnectivity features such as Wi-Fi, Bluetooth, and GPS.

Unless the context clearly requires otherwise, throughout thedescription and the claims, the words “comprise,” “comprising,” and thelike are to be construed in an inclusive sense, as opposed to anexclusive or exhaustive sense; that is to say, in the sense of“including, but not limited to.” The word “coupled”, as generally usedherein, refers to two or more elements that may be either directlyconnected, or connected by way of one or more intermediate elements.Additionally, the words “herein,” “above,” “below,” and words of similarimport, when used in this application, shall refer to this applicationas a whole and not to any particular portions of this application. Wherethe context permits, words in the above Description using the singularor plural number may also include the plural or singular numberrespectively. The word “or” in reference to a list of two or more items,that word covers all of the following interpretations of the word: anyof the items in the list, all of the items in the list, and anycombination of the items in the list.

The above detailed description of embodiments of the invention is notintended to be exhaustive or to limit the invention to the precise formdisclosed above. While specific embodiments of, and examples for, theinvention are described above for illustrative purposes, variousequivalent modifications are possible within the scope of the invention,as those skilled in the relevant art will recognize. For example, whileprocesses or blocks are presented in a given order, alternativeembodiments may perform routines having steps, or employ systems havingblocks, in a different order, and some processes or blocks may bedeleted, moved, added, subdivided, combined, and/or modified. Each ofthese processes or blocks may be implemented in a variety of differentways. Also, while processes or blocks are at times shown as beingperformed in series, these processes or blocks may instead be performedin parallel, or may be performed at different times.

The teachings of the invention provided herein can be applied to othersystems, not necessarily the system described above. The elements andacts of the various embodiments described above can be combined toprovide further embodiments.

While some embodiments of the inventions have been described, theseembodiments have been presented by way of example only, and are notintended to limit the scope of the disclosure. Indeed, the novel methodsand systems described herein may be embodied in a variety of otherforms; furthermore, various omissions, substitutions and changes in theform of the methods and systems described herein may be made withoutdeparting from the spirit of the disclosure. The accompanying claims andtheir equivalents are intended to cover such forms or modifications aswould fall within the scope and spirit of the disclosure.

What is claimed is:
 1. A wireless device comprising: a transceiver; aradio-frequency (RF) module in communication with the transceiver andconfigured to process an RF signal, the RF module including a packagingsubstrate configured to receive a plurality of components, the RF modulefurther including a plurality of shielding wirebonds implemented on thepackaging substrate and configured to provide RF shielding functionalityfor one or more regions on the packaging substrate, the packagingsubstrate including a first area associated with implementation of eachshielding wirebond, the RF module further including one or more devicesmounted on the packaging substrate, the packaging substrate furtherincluding a second area associated with mounting of each of the one ormore devices, each device mounted with respect to a correspondingshielding wirebond such that the second area associated with the deviceoverlaps at least partially with the first area associated with thecorresponding shielding wirebond; and an antenna in communication withthe RF module and configured to facilitate transmission or reception ofthe RF signal.